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SMARTIES

Surface Modified Alloy Resource of Ti based Implant with Electromagnetic Structures

This research is funded by a grant from the Romanian Ministry of Education and Research, CNCS-UEFISCDI, project number PN-III-P4-ID-PCE-2020-0404, within PNCDI III

CONFERENCE PUBLICATION

[C2] Conjointly Electromagnetic Simulations for Bended Microstrip Antenna Designs

Abstract

Investigative electromagnetic (EM) simulations for bended antenna designs, also used for wearable devices, plays an important role in the design process. The simulation for conformal antennas is time consuming also considering the effects of the presence of the feeding/beamforming network on the antenna performances. To tackle this drawback, a new simulation environment is created, where Keysight ADS tool is employed for modeling the initial microstrip antenna of which shape is determined using a bottom-up optimization (BUO) method. The employed BUO in the ADS environment significantly helps the designer in generating the antenna geometries that exhibit the required performances in terms of bandwidth and radiation patterns. Afterwards, the CST Microwave Studio (Dassault Systèmes) is used for bending the previously designed flat microstrip antenna, and accurately evaluate its performances by numerical simulations. To verify the efficiency of the proposed methodology, one bended microstrip antenna in the frequency band of 8.8-9.4 GHz is designed and the radiation pattern responses are depicted.

Keywords

Microwave antennas, Wearable computers, Microstrip antennas, Bending, Microwave theory and techniques, Antenna feeds, Microstrip, Bended microstrip antenna, bottom-up optimization (BUO)

Published In: 2021 13th International Conference on Electrical and Electronics Engineering (ELECO)
Date:

2021-11-25

Location:

Bursa, Turkey

DOI:

10.23919/ELECO54474.2021.9677726

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How to cite:

L. Kouhalvandi, L. Matekovits and S. Ozoguz, "Conjointly Electromagnetic Simulations for Bended Microstrip Antenna Designs," 2021 13th International Conference on Electrical and Electronics Engineering (ELECO), 2021, pp. 301-304, doi: 10.23919/ELECO54474.2021.9677726.